发明名称 SOFT MAGNETIC THERMOSETTING ADHESIVE FILM, SOFT MAGNETIC FILM-LAMINATED CIRCUIT BOARD, AND POSITION-DETECTING DEVICE
摘要 This soft magnetic thermosetting adhesive film is formed from a soft magnetic thermosetting composition containing soft magnetic particles, acrylic resin, epoxy resin, phenolic resin, and a thermosetting catalyst. In the soft magnetic thermosetting composition, the total content of epoxy resin and phenolic resin is from 20 to 99 parts by mass per 100 parts by mass of soft magnetic particle-excluded components excluding the soft magnetic particles.
申请公布号 WO2014132701(A1) 申请公布日期 2014.09.04
申请号 WO2014JP50999 申请日期 2014.01.20
申请人 NITTO DENKO CORPORATION 发明人 HABU, TAKASHI;EBE, HIROFUMI
分类号 C09J7/00;C08L63/00;C09J11/04;C09J133/00;C09J161/06;C09J163/00;H01F1/26 主分类号 C09J7/00
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