发明名称 ELECTRONIC MODULE AND PRODUCTION METHOD FOR SAME
摘要 <p>[Problem] To provide an electronic module that can be miniaturized and in which radiation properties can be improved, and a production method for the same. [Solution] An electronic module (1) provided with: a first functional part (10) including a substrate (11), an electronic part (12) attached to the substrate (11), and a substrate (13) that is arranged to face the substrate (11) and is thermally connected to the electronic part (12) attached to the substrate (11); a second functional part (20) including a substrate (21) and an electronic part (22), and being connected electrically to the first functional part (10); and a heat sink (30) that cools the first functional part (10) and the second functional part (20). The heat sink (30) includes a base plate (31) to which a storage part (31a) is internally provided. The first functional part (10) is housed within a storage part (31a1) such that the substrate (11) and the substrate (13) are contacted to an inner wall of the storage part (31a1) of the base plate (31). The second functional part (20) is fixed upon the base plate (31) such that the substrate (21) is contacted to a main surface (31b) of the base plate (31).</p>
申请公布号 WO2014132425(A1) 申请公布日期 2014.09.04
申请号 WO2013JP55578 申请日期 2013.02.28
申请人 SHINDENGEN ELECTRIC MANUFACTURING CO., LTD. 发明人 IKEDA KOSUKE;SHIMIZU MASAAKI
分类号 H01L25/07;H01L23/36;H01L25/18;H02M3/155;H05K7/20 主分类号 H01L25/07
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