| 摘要 |
<p>A device and method for bonding first substrates to second substrates. The device includes: a receptacle for accommodating a carrier substrate, a placement device for placing multiple first substrates on a substrate side of the carrier substrate that faces away from the receptacle, and a fixing device for fixing each of the first substrates on the substrate side on at least one fixing section of each first substrate. The method includes the following steps: placement of multiple first substrates on a substrate side of a carrier substrate accommodated on a receptacle, and fixing of each first substrate on the substrate side on at least one fixing section of each first substrate.</p> |
