摘要 |
The present invention relates to an exhaust gas monitoring device of wafer processing equipment. The main objective of the prevent invention is to enable real time monitoring of leakage, which can occur at one or more places in the configuration of the wafer processing equipment, to fundamentally prevent leakage accidents. The present invention for obtaining the objective relates to a wafer processing equipment comprising: a semiconductor process equipment for performing an impurity ion implantation process, a thin film deposition process, an etching process, and a planarization process, etc. on a waver surface; a main body provided at one side of the semiconductor process equipment; at least one conveyor for conveying wafers into the main body; a wafer cassette in which wafers delivered by the conveyor are stacked in a large quantity; and a side storage having an exhaust pipe for ejecting process gas remaining on the wafer through an exhaust port with a pump driven by the wind power generated at an exhaust device arranged on the main body, wherein the wafer process equipment includes an exhaust gas monitoring device arranged on the exhaust pipe of the side storage. Accordingly, an advantage of enabling real time monitoring of leakage, which can occur at one or more places in the configuration of the wafer processing equipment, is obtained to fundamentally prevent leakage accidents. |