发明名称 CIRCUIT BOARD AND MANUFACTURING METHOD OF THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a circuit board which is unlikely to be damaged at the time of bending.SOLUTION: A circuit board 10 comprises a substrate body 12 in which a plurality of flexible base material layers 18 are laminated in a z-axis direction and which extends in an x-axis direction. The substrate body 12 includes: a first part P1 which has at least a principal surface S1 provided on a z-axis negative direction side and a principal surface S2 provided in a z-axis positive direction side; a second part P2 which has at least a principal surface S3 provided in the z-axis negative direction side and a principal surface S4 provided on the z-axis positive direction side, and which is connected to one end of the first part P1 along the x-axis direction and has a thickness in the z-axis direction is thicker than that of the first part P1; and a first connection surface Sc1 which is at least one first connection surface Sc1 for connecting the principal surface S1 and the principal surface S3, and has a curved surface C1 denting from the first part P2 side to the second part P2.
申请公布号 JP2014160776(A) 申请公布日期 2014.09.04
申请号 JP20130031295 申请日期 2013.02.20
申请人 MURATA MFG CO LTD 发明人 GOCHI NAOKI
分类号 H05K1/02;H05K3/46 主分类号 H05K1/02
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