FILM-FORMING APPARATUS AND FILM-FORMING METHOD

摘要

A film-forming apparatus (100) includes: a vacuum chamber (30) configured to store a substrate (34B) in which a through-hole is formed and a source of copper emission (35B); a vacuum pump (36) configured to decompress an interior of the vacuum chamber (30) to a predetermined degree of vacuum; a power supply (80) configured to generate electric power applied to the substrate (34B); and a driving mechanism for use in setting a distance between the substrate (34B) and the source of copper emission (35B). When a copper material emitted from the source of copper emission (35B) is deposited on one main surface of the substrate (34B) to block an opening of the through-hole in the one main surface by means of a deposited film formed of the copper material, a blocked state of the opening blocked by the deposited film is adjusted based on the distance and the electric power.

主权项

1. A film-forming apparatus comprising:
a vacuum chamber configured to store a substrate in which a through-hole is formed and a source of copper emission; a vacuum pump configured to decompress an interior of the vacuum chamber to a predetermined degree of vacuum; a power supply configured to generate electric power applied to the substrate; and a driving mechanism for use in setting a distance between the substrate and the source of copper emission, wherein when a copper material emitted from the source of copper emission is deposited on one main surface of the substrate to block an opening of the through-hole in the one main surface by means of a deposited film formed of the copper material, a blocked state of the opening blocked by the deposited film is adjusted based on the distance and the electric power.