SEMICONDUCTOR DEVICE

摘要

[Problem] To improve the efficiency of wire connection between a semiconductor chip and a wiring substrate which are laminated. [Solution] A semiconductor device (100) is provided with: a wiring substrate (108) which comprises a plurality of substrate electrodes (116) arranged therein; a first semiconductor chip (102) which is laminated on the wiring substrate (108) and comprises a plurality of pads (118) that are arranged along a first side that faces the plurality of substrate electrodes (116); and a second semiconductor chip (104) which is laminated on the first semiconductor chip (102) and comprises a plurality of pads (118) that are arranged along a second side that faces the plurality of substrate electrodes (116). With respect to the group of pads (118) of one of the first semiconductor chip (102) and the second semiconductor chip (104), some pads (118) arranged in the central portion are connected to the plurality of substrate electrodes (116). With respect to the group of pads (118) of the other semiconductor chip, some pads (118) arranged in the end portions are connected to the plurality of substrate electrodes (116).