WIRING BOARD WITH BUILT-IN ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME

摘要

A wiring board with a built-in electronic component includes a core substrate having a penetrating hole formed in the core substrate, an electronic component accommodated in the penetrating hole in the core substrate, a conductive pattern layer formed on a first surface of the core substrate and including a first conductive pattern and a second conductive pattern, and an interlayer insulation layer formed over the conductive pattern layer and the first surface of the core substrate. The second conductive pattern is formed adjacent to a periphery of the penetrating hole such that the second conductive pattern is formed along an outline of the periphery of the penetrating hole.

主权项

1. A wiring board with a built-in electronic component, comprising:
a core substrate having a penetrating hole formed in the core substrate; an electronic component accommodated in the penetrating hole in the core substrate; a conductive pattern layer formed on a first surface of the core substrate and including a first conductive pattern and a second conductive pattern; and an interlayer insulation layer formed over the conductive pattern layer and the first surface of the core substrate, wherein the second conductive pattern is formed adjacent to a periphery of the penetrating hole such that the second conductive pattern is formed along an outline of the periphery of the penetrating hole.