| 摘要 |
<p>The purpose of the present invention is to provide a cooling device capable of cooling an electronic apparatus with high efficiency even in such a case of high heat generation as when a plurality of servers are housed so as to be stacked within a housing, or in a case in which a device is placed in an environment of high temperature or high humidity. To this end, among two opposed side surfaces of a housing having a storage chamber for an electronic apparatus, on one side surface is disposed a first evaporator, and on another side surface is disposed a second evaporator. With the first evaporator is configured a first refrigeration cycle, and with the second evaporator is configured a second refrigeration cycle. Air cooled with the first evaporator flows in the order of the storage chamber of the electronic apparatus, and then the second evaporator, and the air is circulated so as to return to the first evaporator. At this time, the first refrigeration cycle and the second refrigeration cycle are configured or controlled so that the cooling ratio between the first evaporator and the second evaporator is such that the ratio of the second evaporator is greater than the ratio of the first evaporator.</p> |
