| 摘要 |
There is provided a thermosetting resin composition having excellent flowability, low temperature moldability, curability, and heat resistance after curing or the like in the absence of a solvent. The thermosetting resin composition of the present invention contains, as essential components, a maleimide compound (A), a compound (B) having two or more polymerizable unsaturated hydrocarbon groups in its molecule, and a cyanate ester compound (C). |
