| 摘要 |
Provided are an apparatus which promptly heats a substrate, a method therefor, and a recording medium. The substrate heat treatment apparatus (2) comprises: a heat plate (40); a heat plate rotating device (60); a substrate elevating device (70); and a control unit (21). The heat plate (40) comprises: a plate-shape unit which has flexibility and faces a horizontally arranged surface (Wa) of a wafer (W) by having a gap from the wafer; and a plurality of grooves with the spiral shape arranged beneath the plate-shape unit and extended from the center of the plate-shape unit toward the edge of the circumference. The control unit (21) controls the heat plate rotating device (60) to rotate the heat plate (40) in a direction that the groove is extended from the center of the plate-shape unit and the substrate elevating device (70) to closely dispose the wafer (W) and the heat plate (40). |
