| 摘要 |
<p>A method for slicing a workpiece includes: imparting axial reciprocating motion to a wire wound around a plurality of grooved rollers, the wire including bonded abrasive grains; and pressing the workpiece against the reciprocating wire and feeding the workpiece while supplying a machining liquid to the wire to slice the workpiece into wafers, wherein the workpiece is sliced while repeating a process in which the workpiece is fed in a feed direction by a feed amount of 5 mm or more but no more than 30 mm and then reversed in a direction opposite to the feed direction by a reverse amount which is equal to or more than a quarter of the feed amount, less than the feed amount, and equal to or less than 1/15 of a length of the workpiece in the feed direction. The method can improve the quality of sliced workpiece, particularly nanotopography.</p> |
