| 摘要 |
According to an embodiment of the present invention, provided is a wafer processing apparatus comprising: a first surface plate having a plurality of carriers; a first gear arranged on the center of the first surface plate and engaged with the plurality of carriers; a second gear arranged on edge areas of the first surface plate and engaged with the carriers; a motor rotating the first surface plate in a first direction; a fixing hanger faced with the first surface plate; and a second surface plate hung to the fixing hanger, whereby a clearance with the first surface plate is flexible. |
