| 摘要 |
An electronic component to be mounted on a substrate comprises an electronic component-side land that faces a substrate-side land provided on the substrate when the electronic component is mounted on the substrate. A non-soldered region is provided on a surface of the electronic component-side land, facing the substrate-side land, so that a shape of the substrate-side land is different from a shape of the electronic component-side land facing the substrate-side land. |
