| 摘要 |
<p>A microelectronic package of the present explanation includes a microelectronic interposer having a first surface. The active surface of at least one microelectronic device can be electrically bonded onto the first surface of the microelectronic interposer. A thermal interface material can be arranged on the back surface of the at least one microelectronic device. A heat spreader which has a second surface facing the first surface can be in thermal contact with the thermal interface material by the first surface. A mold member is arranged to capsulate the microelectronic device, the thermal interface material, and the heat spreader. The mold member touches at least parts of the first surface of the microelectronic interposer.</p> |
