发明名称 |
PLATING METHOD OF METAL WIRE |
摘要 |
Disclosed is a method for plating a metal wire. The method for plating a metal wire according to an embodiment of the present invention includes a step for preparing a first bobbin having a plurality of wound metal wires; a step for transferring the respective metal wires separated from the first bobbin; a step for plating the respective metal wires by passing the respective transferred metal wires through a plating apparatus; and a step for winding the respective plated metal wires onto a second bobbin. |
申请公布号 |
KR20140106074(A) |
申请公布日期 |
2014.09.03 |
申请号 |
KR20130020111 |
申请日期 |
2013.02.25 |
申请人 |
SAMWON ELECTRIC CABLE CO.,LTD. |
发明人 |
CHOI, SUK MOON |
分类号 |
C23C2/08;C23C2/38;C25D3/30 |
主分类号 |
C23C2/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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