发明名称 PLATING METHOD OF METAL WIRE
摘要 Disclosed is a method for plating a metal wire. The method for plating a metal wire according to an embodiment of the present invention includes a step for preparing a first bobbin having a plurality of wound metal wires; a step for transferring the respective metal wires separated from the first bobbin; a step for plating the respective metal wires by passing the respective transferred metal wires through a plating apparatus; and a step for winding the respective plated metal wires onto a second bobbin.
申请公布号 KR20140106074(A) 申请公布日期 2014.09.03
申请号 KR20130020111 申请日期 2013.02.25
申请人 SAMWON ELECTRIC CABLE CO.,LTD. 发明人 CHOI, SUK MOON
分类号 C23C2/08;C23C2/38;C25D3/30 主分类号 C23C2/08
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