| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing process of a thin-film device that utilizes transfer technologies, the thin-film device capable of preventing electrification produced due to induction after the manufacture, and a method of manufacturing the thin-film device. SOLUTION: The manufacturing method of the thin-film device includes a step of transferring a thin-film element (transfer object layer 110) on a second conductive transfer substrate 120 and a step thereafter of connecting an electrode terminal 130 for imparting reference potential to a thin film element circuit formed of the thin-film element, or the like, to the second conductive transfer substrate 120. COPYRIGHT: (C)2010,JPO&INPIT |
