发明名称 CONTACT ASSEMBLY HAVING MICRO PITCH, CONTACT SEMI ASSEMBLY, AND PREPARATION METHOD THEREOF
摘要 The present invention relates to a contact assembly having a micro pitch, a contact semi assembly, and a preparation method thereof. The contact assembly having a micro pitch according to one embodiment of the present invention comprises a unit contact module. According to one embodiment of the present invention, the unit contact module includes contact pins. Both ends of the contact pin are exposed to the inner part or the surface of an insulating film.
申请公布号 KR20140106307(A) 申请公布日期 2014.09.03
申请号 KR20130020693 申请日期 2013.02.26
申请人 OKINS ELECTRONICS CO., LTD. 发明人 JUN, JIN GUK;PARK, SUNG KYU;PARK, YOUNG SIG
分类号 G01R1/067;G01R31/26;H01L21/66 主分类号 G01R1/067
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