Semiconductor power module

摘要

An object of the present invention is to mount, for example, 12 arms compactly on a single semiconductor power module, to dispose DC terminals and AC terminals on an edge of the module and to keep inductance of a power circuit at a low level. According to the invention, two sets of upper arms (100,104 and 102,106) are disposed on the upper right and left sides of an insulated substrate 108, two sets of lower arms (101,105 and 103,107) are disposed on the lower right and left sides of the insulated substrate, the two sets of upper arms are mounted on a first wiring pattern C01 as wiring patterns on the insulated substrate, the two sets of lower arms are mounted respectively on second and third wiring patterns CO2 and CO2 disposed under the first wiring pattern, the first wiring pattern C01 is extended between the second and third wiring patterns, wiring from a positive terminal T01 is connected to the extended end portion, and three insulated substrates 108 are mounted in parallel to constitute a 12-in-1 module.