发明名称 Headset signal multiplexing system and method
摘要 A system and method for supplying power to a headset, and for transmitting multiple signals generated in the headset to a terminal using frequency division multiplexing. An audio signal and a carrier signal are generated in the terminal and summed together to form a composite uplink signal. The composite uplink signal is provided to a headset over a first physical channel. At the headset, the audio and carrier signals are separated, and the carrier signal is used to generate power in the headset. Signals generated by a plurality of acoustic sensors in the headset are combined using frequency division multiplexing to generate a composite downlink signal, which is transmitted to the terminal over a second physical channel. One or more carrier signals used to generate the composite downlink signal are provided by either a carrier source in the headset, or by recovering the carrier signal from the composite uplink signal.
申请公布号 US8824696(B2) 申请公布日期 2014.09.02
申请号 US201113159988 申请日期 2011.06.14
申请人 VOCOLLECT, Inc. 发明人 Braho Keith
分类号 H04R1/10;H04R3/00 主分类号 H04R1/10
代理机构 Additon, Higgins & Pendleton P.A. 代理人 Additon, Higgins & Pendleton P.A.
主权项 1. A headset comprising: a first acoustic sensor mounted on the headset having an output signal; at least one second acoustic sensor mounted on the headset having an output signal; modulator circuitry configured to receive a carrier signal and coupled to receive the output signal of the second acoustic sensor, the modulator circuitry configured for modulating a carrier signal with the output signal of the second acoustic sensor to provide a modulated output signal reflective of the output signal of the second acoustic sensor; combining circuitry coupled to receive and combine the output signal of the first acoustic sensor and the modulated output signal to produce a composite downlink signal that reflects the output signals of the first and at least one second acoustic sensors for transmission over a common conductor; at least first and second electrical connections configured for providing a connection to a terminal device; and at least one of the electrical connections coupled with the combining circuitry for handling the composite downlink signal and directing the composite downlink signal to the terminal device.
地址 Pittsburgh PA US