发明名称 |
Headset signal multiplexing system and method |
摘要 |
A system and method for supplying power to a headset, and for transmitting multiple signals generated in the headset to a terminal using frequency division multiplexing. An audio signal and a carrier signal are generated in the terminal and summed together to form a composite uplink signal. The composite uplink signal is provided to a headset over a first physical channel. At the headset, the audio and carrier signals are separated, and the carrier signal is used to generate power in the headset. Signals generated by a plurality of acoustic sensors in the headset are combined using frequency division multiplexing to generate a composite downlink signal, which is transmitted to the terminal over a second physical channel. One or more carrier signals used to generate the composite downlink signal are provided by either a carrier source in the headset, or by recovering the carrier signal from the composite uplink signal. |
申请公布号 |
US8824696(B2) |
申请公布日期 |
2014.09.02 |
申请号 |
US201113159988 |
申请日期 |
2011.06.14 |
申请人 |
VOCOLLECT, Inc. |
发明人 |
Braho Keith |
分类号 |
H04R1/10;H04R3/00 |
主分类号 |
H04R1/10 |
代理机构 |
Additon, Higgins & Pendleton P.A. |
代理人 |
Additon, Higgins & Pendleton P.A. |
主权项 |
1. A headset comprising:
a first acoustic sensor mounted on the headset having an output signal; at least one second acoustic sensor mounted on the headset having an output signal; modulator circuitry configured to receive a carrier signal and coupled to receive the output signal of the second acoustic sensor, the modulator circuitry configured for modulating a carrier signal with the output signal of the second acoustic sensor to provide a modulated output signal reflective of the output signal of the second acoustic sensor; combining circuitry coupled to receive and combine the output signal of the first acoustic sensor and the modulated output signal to produce a composite downlink signal that reflects the output signals of the first and at least one second acoustic sensors for transmission over a common conductor; at least first and second electrical connections configured for providing a connection to a terminal device; and at least one of the electrical connections coupled with the combining circuitry for handling the composite downlink signal and directing the composite downlink signal to the terminal device. |
地址 |
Pittsburgh PA US |