发明名称 Surface treatment methods and systems for substrate processing
摘要 Embodiments provided herein describe methods and systems for processing substrates. A plasma including radical species and charged species is generated. The charged species of the plasma are collected. A substrate is exposed to the radical species of the plasma. A layer is formed on the substrate after exposing the substrate to the radical species.
申请公布号 US8822313(B2) 申请公布日期 2014.09.02
申请号 US201213722820 申请日期 2012.12.20
申请人 Intermolecular, Inc. 发明人 Lang Chi-I;Niyogi Sandip
分类号 H01L21/265;H01L21/365;H01L21/02 主分类号 H01L21/265
代理机构 代理人
主权项 1. A method for processing a substrate in a chamber, the method comprising: generating a plasma in the chamber, wherein the plasma comprises radical species and charged species and the plasma species is based on one of hydrogen, nitrogen, argon, oxygen, ammonia, helium, or a combination thereof; collecting the charged species; providing the radical species to the substrate, wherein a film feedstock is not provided to the substrate during the providing of the radical species to the substrate; and after the providing, depositing a layer on the substrate.
地址 San Jose CA US