Sintered silver joints via controlled topography of electronic packaging subcomponents

摘要

Disclosed are sintered silver bonded electronic package subcomponents and methods for making the same. Embodiments of the sintered silver bonded EPSs include topography modification of one or more metal surfaces of semiconductor devices bonded together by the sintered silver joint. The sintered silver bonded EPSs include a first semiconductor device having a first metal surface, the first metal surface having a modified topography that has been chemically etched, grit blasted, uniaxial ground and/or grid sliced connected to a second semiconductor device which may also include a first metal surface with a modified topography, a silver plating layer on the first metal surface of the first semiconductor device and a silver plating layer on the first metal surface of the second semiconductor device and a sintered silver joint between the silver plating layers of the first and second semiconductor devices which bonds the first semiconductor device to the second semiconductor device.

主权项

1. A sintered silver bonded electronic packaging subcomponent comprising:
a first electronic subcomponent comprising
a first substrate;a first metal layer having a first metal surface and a second metal surface with the second metal surface formed on or connected to the first substrate, wherein the first metal surface includes a modified topography to increase a roughness of the first metal surface, wherein the modified topography of the first metal surface of the first metal layer is uniaxially ground, grid sliced, grit blasted or chemically etched; and a first silver plating layer formed on the modified first metal surface, wherein the increased roughness of the modified first metal surface increases mechanical interlocking of the first silver plating to the modified surface of the first metal surface; a second electronic subcomponent comprising
a second substrate;a second metal layer having a first metal surface and a second metal surface with the second metal surface formed on or connected to the second substrate; and a sintered silver joint connecting the first electronic subcomponent to the second electronic subcomponent at the first silver plating layer and the second metal layer.