Solution for removing residue after semiconductor dry process and method of removing the residue using the same

摘要

A residue-removing solution for removing residues present on semiconductor substrates after dry etching and/or ashing, the residue-removing solution comprising a Cu surface protective agent including: at least one compound selected from compounds (1), (2) and (3) each having as a basic skeleton a five-membered or six-membered heteratomic structure as defined herein; a compound capable of forming a complex or chelate with Cu (copper); and water. Further, the residue-removing solution has a pH of 4 to 9.

主权项

1. A residue-removing solution for removing residues present on semiconductor substrates after dry etching and/or ashing, the residue-removing solution comprising:
a Cu surface protective agent comprising at least one compound selected from the group consisting of:
(1) indazoles;(2) at least one member selected from the group consisting of mercaptoimidazoles, mercaptooxazoles, mercaptothiazoles, mercaptobenzimidazoles, and mercaptobenzoxazoles; and(3) at least one member selected from the group consisting of pyrimidines, pyridazines, quinazolines, quinoxalines, and cinnolines; a compound capable of forming a complex or chelate with Cu being at least one member selected from the group consisting of keto acids; keto acid salts formed from keto acids and hydroxylamine, primary, secondary, or tertiary amines, quaternary ammonium, or polyamines; aldehyde acid salts formed from glyoxylic acid and hydroxylamine, primary, secondary, or tertiary amines, quaternary ammonium, or polyamines; polycarboxylic acid salts formed from malonic acid, succinic acid, glutaric acid, adipic acid, or malic acid, and hydroxylamine, alkanolamines, primary, secondary, or tertiary amines, quaternary ammonium, or polyamines; monochloroacetic acid, dichloroacetic acid, trichloroacetic acid, α-chlorobutanoic acid, β-chlorobutanoic acid, γ-chlorobutanoic acid, monofluoroacetic acid, difluoroacetic acid, trifluoroacetic acid, hydrobromic acid, perchloric acid, sulfuric acid, or malonic acid; a neutral organic solvent having an oxygen atom capable of coordinating to Cu; and monohydric alcohol with 4 or more carbon atoms; and water; and the residue-removing solution having a pH of 4 to 7.