Contact pads with sidewall spacers and method of making contact pads with sidewall spacers

摘要

A chip contact pad and a method of making a chip contact pad are disclosed. An embodiment of the present invention includes forming a plurality of contact pads over a workpiece, each contact pad having lower sidewalls and upper sidewalls and reducing a lower width of each contact pad so that an upper width of each contact pad is larger than the lower width. The method further includes forming a photoresist over the plurality of contact pads and removing portions of the photoresist thereby forming sidewall spacers along the lower sidewalls.

主权项

1. A method of making a semiconductor device, the method comprising:
forming a plurality of contact pads over a workpiece, each contact pad having lower sidewalls and upper sidewalls; reducing a lower width of each contact pad so that an upper width of each contact pad is larger than the lower width; forming a photoresist over the plurality of contact pads; and removing portions of the photoresist thereby forming sidewall spacers along the lower sidewalls wherein forming the plurality of contact pads comprises forming a copper layer or copper alloy layer lower portion and then forming a metallic material layer stack upper portion, wherein the metallic material layer stack comprises nickel (Ni), and wherein forming the photoresist comprises forming a positive photoresist.