Front side wafer ID processing

摘要

A method for printing a wafer ID on a wafer, the method comprises identifying a wafer ID on a back side of the wafer. Subsequently, etching a plurality of recesses, consistent in size with chip features of the wafer, into the front side of the wafer, such that the plurality of recesses depicts the wafer ID. The method further comprises filling the recesses with a metal.

主权项

1. A method for printing a wafer ID on a wafer, the method comprising the steps of:
identifying a wafer ID for a wafer; patterning the wafer ID in an etch mask on a front side of the wafer, wherein each character of the wafer ID patterned into the etch mask includes a plurality of openings substantially matching feature sizes of fabricated chip features on the wafer; etching the front side of the wafer through the plurality of openings in the etch mask to produce a plurality of recesses in the wafer that collectively depict the wafer ID; and filling the plurality of recesses in the wafer with a metal.