发明名称 Optical semiconductor device and method for fabricating the optical semiconductor device
摘要 An optical semiconductor device, includes: a plurality of first diffraction grating layers disposed at a spacing from each other along first direction above first semiconductor layer, length of a lower surface of each of a plurality of first diffraction gratings along first direction being longer than a length of an upper surface of first diffraction grating; second diffraction grating layer disposed along first direction above first semiconductor layer, first and second diffraction grating layers being alternately disposed at a spacing from each other, a length of an upper surface of second diffraction grating layer along first direction being longer than the length of a lower surface of second diffraction layer; a diffraction grating including first and second diffraction grating layers; a second semiconductor layer disposed between first and second diffraction grating layers and under second diffraction grating layer; and third semiconductor layer disposed on first and second diffraction grating layers.
申请公布号 US8824842(B2) 申请公布日期 2014.09.02
申请号 US201113043277 申请日期 2011.03.08
申请人 Fujitsu Limited 发明人 Matsumoto Takeshi
分类号 G02B6/34;H01L33/00;G02B6/12;H01S5/22;G02B6/124;H01L21/02;B82Y20/00;H01S5/12;H01S5/32;H01S5/34 主分类号 G02B6/34
代理机构 Fujitsu Patent Center 代理人 Fujitsu Patent Center
主权项 1. An optical semiconductor device fabrication method, comprising: forming a first semiconductor layer and a first diffraction grating layer above a substrate; forming a grating pattern mask above the first diffraction grating layer, the mask including a plurality of stripes spaced from each other along a first direction; etching the first diffraction grating layer exposed in the grating pattern mask; etching the first semiconductor layer exposed in the grating pattern mask to form a plurality of ridges in the first semiconductor layer along the first direction; forming a second semiconductor layer on a bottom surface of one of a plurality of first grooves formed between adjacent ones of the plurality of ridges in the first semiconductor layer; removing the grating pattern mask before or after the step of forming the second semiconductor layer; selectively forming a second diffraction grating layer dominantly in second grooves in the second semiconductor layer, the second grooves in the second semiconductor layer being above the first grooves between the ridges, the second diffraction grating layer having a refractive index different from a refractive index of the second semiconductor layer; and forming a third semiconductor layer on diffraction gratings included in the first and the second diffraction grating layers and on the second semiconductor layer.
地址 Kawasaki JP