发明名称 Thermally conductive member, and battery device using the same
摘要 An object is to, in a battery pack device in which battery cells are lined up, provide a thermally conductive member that can reduce the risk of heat being conducted to an adjacent battery cell in order to make the cooling property of each battery cell uniform, and a battery pack device using this thermally conductive member. Provided is a thermally conductive member arranged between battery cells when assembling the battery cells into a battery pack, wherein the thermally conductive member includes thermally conductive layers each having a thermal conductivity of 0.5 W/mK or more provided respectively on both sides of a backing layer having a thermal conductivity of less than 0.5 W/mK. Especially, it is preferred that a resin member forming the backing layer has a flexural modulus of 1 GPa or more.
申请公布号 US8822058(B2) 申请公布日期 2014.09.02
申请号 US201313944591 申请日期 2013.07.17
申请人 Nitto Denko Corporation 发明人 Terada Yoshio;Shouji Akira;Tomioka Kouki;Furuta Kenji;Tojo Midori;Hayashi Kazunori;Moriki Shoujirou
分类号 H01M10/50;H01M10/04 主分类号 H01M10/50
代理机构 Westerman, Hattori, Daniels & Adrian, LLP 代理人 Westerman, Hattori, Daniels & Adrian, LLP
主权项 1. A thermally conductive member having a sheet shape and arranged between battery cells in a battery pack which has plurality of battery cells, the thermally conductive member comprising a three-layer laminated structure which is composed of a backing layer, a first thermally conductive layer arranged between a first battery cell and the backing layer, wherein the first battery cell is one of the plural of battery cells, and a second thermally conductive layer arranged between a second battery cell arranged next to the first battery cell and the backing layer, a first surface which is in contact with the first battery cell, and a second surface which is in contact with the second battery cell, wherein the backing layer has a thermal conductivity of less than 0.5 W/mK and each of the first and second thermally conductive layers has a thermal conductivity of 0.5 W/mK or more.
地址 Ibaraki-shi JP