发明名称 Component having an overlapping laser track; method for producing such a component
摘要 A component having a laser track as a fracture initiation line, said laser track being composed of laser holes formed by a laser beam for preparing for a later separation of the component into individual components. In order to ensure that, upon separation, the fracture always extends along the laser track, fractures deviating from the laser track are avoided, and the fracture edges after fracture are formed evenly and do not have jagged edges, it is proposed that the distance between two adjacent laser holes be less than or equal to the diameter of said laser holes, in each case measured on the surface of the component.
申请公布号 US8822003(B2) 申请公布日期 2014.09.02
申请号 US201013259449 申请日期 2010.03.26
申请人 CeramTec GmbH 发明人 Reiss Kunibert;Karl Thomas;Kluge Claus Peter
分类号 B32B3/24;B23K26/40;B23K26/06;H01L21/78;C03B33/02;B23K26/36;C03B33/08 主分类号 B32B3/24
代理机构 Fulbright & Jaworski LLP 代理人 Fulbright & Jaworski LLP
主权项 1. A component comprising a laser track as a fracture initiation line, said laser track consisting of laser holes formed by a laser beam for preparing for a later separation of the component into individual components, wherein the distance A between two adjacent laser holes is smaller or equal to the diameter D of said laser holes, in each case measured on the surface of the component; wherein the components are ceramic plates which are used as substrates for electronic or electric components, and wherein the laser track is created in opposing side faces of the component.
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