Wiring board, electronic component embedded substrate, method of manufacturing wiring board, and method of manufacturing electronic component embedded substrate

摘要

A wiring board or an electronic component embedded substrate includes a substrate that includes a resin containing a plurality of fillers; and a via that is electrically connected to at least one interconnect provided to the substrate, wherein the via includes a mix area in which metal is provided between the fillers on an inner radial side with respect to the substrate. A method of manufacturing a wiring board or an electronic component embedded substrate includes preparing a substrate that includes a resin containing a plurality of fillers; forming a via formation hole in the substrate; performing an ashing process on at least an inner wall of the via formation hole; and performing electroless plating an the inner wall of the via formation hole.

主权项

1. A wiring board comprising:
a substrate that includes a resin containing a plurality of first fillers and a plurality of second fillers; and a via that extends in a thickness direction of the substrate, the via being electrically connected to at least one interconnect provided to the substrate, wherein the via includes a mix area provided on an outer radial side of the via and within the substrate, the mix area including the resin and metal provided between the plurality of second fillers, and at least some of the second fillers are not connected to other ones of the second fillers through the resin, wherein the mix area has a thickness less than 3 μm.