| 发明名称 |
Packaged IC having printed dielectric adhesive on die pad |
| 摘要 |
A method of assembling a packaged integrated circuit (IC) includes printing a viscous dielectric polymerizable material onto a die pad of a leadframe having metal terminals positioned outside the die pad. An IC die having a top side including a plurality of bond pads is placed with its bottom side onto the viscous dielectric polymerizable material. Bond wires are wire bonded between the plurality of bond pads and the metal terminals of the leadframe. |
| 申请公布号 |
US8822274(B2) |
申请公布日期 |
2014.09.02 |
| 申请号 |
US201213644627 |
申请日期 |
2012.10.04 |
| 申请人 |
Texas Instruments Incorporated |
发明人 |
Suleiman Wan Mohd Misuari;Dahalan Azdhar |
| 分类号 |
H01L21/50 |
主分类号 |
H01L21/50 |
| 代理机构 |
|
代理人 |
Shaw Steven A.;Telecky, Jr. Frederick J. |
| 主权项 |
1. A method of assembling a packaged integrated circuit (IC), comprising:
printing a viscous dielectric polymerizable material onto a die pad of a leadframe having metal terminals positioned outside said die pad; placing at least one IC die having a top side including a plurality of bond pads with its bottom side onto said viscous dielectric polymerizable material; and wire bonding bond wires between said plurality of bond pads and said metal terminals of said leadframe. |
| 地址 |
Dallas TX US |
