Semiconductor device with increased I/O leadframe

摘要

In one embodiment, a semiconductor package (e.g., a QFP package) includes a leadframe sized and configured to increase the available number of exposed leads in the semiconductor package. More particularly, the semiconductor package includes a generally planar die pad defining multiple peripheral edge segments. In addition, the semiconductor package includes a plurality of leads. Some of these leads include exposed bottom surface portions that are provided in at least one row or ring, which at least partially circumvents the die pad, with other leads including portions that protrude from respective side surfaces of a package body of the semiconductor package. At least one semiconductor die is connected to the top surface of the die pad and is electrically connected to at least some of the leads. At least portions of the die pad, the leads, and the semiconductor die are encapsulated by a package body, with at least portions of the bottom surfaces of the die pad and some of the leads being exposed in a common exterior surface of the package body.

主权项

1. A semiconductor package comprising:
a generally planar die pad defining opposed top and bottom surfaces and multiple peripheral edge segments; a plurality of first leads which are segregated into at least two sets which extend along respective ones of at least two peripheral edge segments of the die pad; a plurality of second leads which are segregated into at least two sets which extend along respective ones of at least two peripheral edge segments of the die pad; a semiconductor die attached to the die pad and to portions of the first leads, the semiconductor die covering the entirety of the top surface of the die pad and being electrically connected to at least one of each of the first and second leads; and a package body defining a bottom surface and multiple side surfaces, the package body at least partially encapsulating the first and second leads and the semiconductor die such that at least portions of the bottom surface of the die pad and portions of the first leads are exposed in the bottom surface of the package body, and portions of at least some of the second leads protrude from at least one of the side surfaces of the package body.