Electronic device enclosure assembly

摘要

A method includes forming an assembly of a first part of a computing device enclosure and a second part of the computing device enclosure by disposing a thermoplastic adhesive layer between a surface portion of the first part and an opposing surface portion of the second part. The surface portion of the first part and the opposing surface portion of the second part define one or more bonding areas of the first part and the second part across a lateral extent of the assembly. The assembly has a non-uniform thermal mass distribution across its lateral extent. The method further includes applying spatially varying amounts of heat to the assembly across its lateral extent to soften the thermoplastic adhesive layer in the bonding areas relatively uniformly across the lateral extent of the assembly compared to applying a non-spatially varying amount of heat across the lateral extent of the assembly.

主权项

1. A method, comprising:
inserting a midplane plate having a thermoplastic adhesive layer into a base frame of a computing device enclosure; contacting the thermoplastic adhesive layer of the midplane plate to a surface of the base frame of the computing device enclosure; applying, to the midplane plate, a heat press block having a first portion and a second portion in contact with the midplane plate; and heating the first portion of the heat press block to a first temperature and heating the second portion of the heat press block to a second temperature higher than the first temperature.