Piezoelectric vibrating devices including respective packages in which castellations include respective connecting electrodes

摘要

Piezoelectric vibrating devices are disclosed that lack base through-holes and that can be manufactured on a wafer scale. Also disclosed are methods for making same. An exemplary piezoelectric device has a package base having first and second opposing main surfaces. On the second (outer) first main surface is formed a pair of external electrodes. The first (inner) main surface defines a first recess and a peripheral first bonding surface. A pair of connecting electrodes are provided for connecting to the respective external electrodes via respective edge surfaces of the package base that extend between the first and second main surfaces. A piezoelectric vibrating piece is mounted in and contained within the package base. The vibrating piece includes a pair of excitation electrodes electrically connected to respective connecting electrodes. A package lid comprises first and second main surfaces, of which the second (inner) main surface defines a second recess that is larger than the first recess. The second main surface also defines a second bonding surface that peripherally surrounds the second recess. A sealing material is applied, over the width of the second bonding surface, circumferentially between the first bonding surface and the second bonding surface.

主权项

1. A piezoelectric device, comprising:
a package base having a rectangular profile, the package base including an outer main surface including a pair of external electrodes and an inner main surface situated opposite the outer main surface, the inner main surface defining a first recess and a first bonding surface peripherally surrounding the first recess, and including respective connecting electrodes electrically connected to the external electrodes; a piezoelectric vibrating piece mounted to the inner main surface of the package base and including respective excitation electrodes electrically connected to the connecting electrodes; a package lid defining a second recess and a second bonding surface, the second bonding surface having a width and peripherally surrounding the second recess, the second recess being larger than the first recess, and the lid covering the piezoelectric vibrating piece mounted to the package base; and a sealing material, having a width substantial equal to the width of the second bonding surface, disposed circumferentially between the first bonding surface and the second bonding surface, thereby sealing the package lid to the package base, wherein the package base has a rectangular plan profile, when viewed from above, that includes first and second opposing edges, each edge having a length and defining a respective castellation in a center of the respective edge, each respective castellation having a length that is ⅓ to ½ the length of the respective edge, each connecting electrode is situated in a respective one of said castellations, wherein each connecting electrode has a length that is greater than ½ the length of the respective castellation, and each connecting electrode has a length that is greater than ¼ the length of the respective edge.