| 发明名称 |
Composite wafer including a molded wafer and a second wafer |
| 摘要 |
A composite wafer includes a molded wafer and a second wafer. The molded wafer includes a plurality of first components, and the second wafer includes a plurality of second components. The second wafer is combined with the molded wafer to form the composite wafer. At least one of the first components is aligned with at least one of the second components to form a multi-component element. The multi-component element is singulatable from the composite wafer. |
| 申请公布号 |
US8822275(B2) |
申请公布日期 |
2014.09.02 |
| 申请号 |
US201213459924 |
申请日期 |
2012.04.30 |
| 申请人 |
Hewlett-Packard Development Company, L.P. |
发明人 |
Tan Michael Renne Ty;Panotopoulos Georgios;Rosenberg Paul Kessler;Mathai Sagi Varghese;Sorin Wayne Victor;Patra Susant K |
| 分类号 |
H01L21/78 |
主分类号 |
H01L21/78 |
| 代理机构 |
|
代理人 |
Ward Aaron |
| 主权项 |
1. A method, comprising:
forming a plurality of first components integrated as a molded wafer, each first component including a first mating feature; combining the molded wafer with a second wafer to form a composite wafer, the second wafer including a plurality of second components that is aligned with the plurality of first components when the molded wafer is combined with the second wafer, wherein each second component includes a second mating feature that couples to a corresponding first mating feature when the molded wafer is combined with the second wafer; and singulating the composite wafer into a plurality of multi-component elements, each multi-component element being formed of a first component and a second component. |
| 地址 |
Houston TX US |
