Integrated circuit packaging for implantable medical devices

摘要

A hybrid integrated circuit in a wafer level package for an implantable medical device includes one or more passive component windings formed, at least in part, along one or more routing layers of the package. The windings may be primary and secondary windings of a transformer, wherein all or part of a magnetic core thereof is embedded in a component layer of the wafer level package. If the core includes a part bonded to a surface of the package, that part of the core may be E-shaped with legs extending into the routing layers, and, in some cases, through the routing layers. Routing layers may be formed on both sides of the component layer to accommodate the transformer windings, in some instances.

主权项

1. A planar transformer assembly integrated within a high voltage circuit of an implantable cardioverter defibrillator, the circuit being formed in a wafer level package, the wafer level package comprising a polymer component layer, in which one or more active devices and passive components of the circuit are embedded, and a plurality of routing layers overlaying the component layer, the routing layers having conductive runners forming electrical couplings for the active devices and passive components, and the assembly comprising:
a primary winding and one or more secondary windings being formed in the plurality of routing layers; and a magnetic core comprising a first part embedded in the component layer and second part bonded to a surface of the wafer level package, the surface overlaying the plurality of routing layers, such that the routing layers are sandwiched between the component layer and the second part of the core.