发明名称 Electric device package and method of making an electric device package
摘要 A system and method for manufacturing an electric device package are disclosed. An embodiment comprises a carrier, a component disposed on the carrier, the component having a first component contact pad, and a first electrical connection between the first component contact pad and a first carrier contact pad, wherein the first electrical connection comprises a first hollow space, the first hollow space comprising a first liquid.
申请公布号 US8824145(B2) 申请公布日期 2014.09.02
申请号 US201213492751 申请日期 2012.06.08
申请人 Infineon Technologies AG 发明人 Hosseini Khalil;Mahler Joachim
分类号 H05K7/20 主分类号 H05K7/20
代理机构 Slater & Matsil, L.L.P. 代理人 Slater & Matsil, L.L.P.
主权项 1. An electric device comprising: a carrier comprising a first carrier contact pad and a second carrier contact pad; a component disposed on the carrier, the component having a first component contact pad and a second component contact pad; a first electrical connection between the first component contact pad and the first carrier contact pad, wherein the first electrical connection comprises a first hollow space, and wherein the first hollow space comprises a first liquid; and a second electrical connection between the second component contact pad and the second carrier contact pad, wherein the second electrical connection comprises a second hollow space, and wherein the second hollow space comprises a second liquid.
地址 Neubiberg DE