发明名称 |
Electric device package and method of making an electric device package |
摘要 |
A system and method for manufacturing an electric device package are disclosed. An embodiment comprises a carrier, a component disposed on the carrier, the component having a first component contact pad, and a first electrical connection between the first component contact pad and a first carrier contact pad, wherein the first electrical connection comprises a first hollow space, the first hollow space comprising a first liquid. |
申请公布号 |
US8824145(B2) |
申请公布日期 |
2014.09.02 |
申请号 |
US201213492751 |
申请日期 |
2012.06.08 |
申请人 |
Infineon Technologies AG |
发明人 |
Hosseini Khalil;Mahler Joachim |
分类号 |
H05K7/20 |
主分类号 |
H05K7/20 |
代理机构 |
Slater & Matsil, L.L.P. |
代理人 |
Slater & Matsil, L.L.P. |
主权项 |
1. An electric device comprising:
a carrier comprising a first carrier contact pad and a second carrier contact pad; a component disposed on the carrier, the component having a first component contact pad and a second component contact pad; a first electrical connection between the first component contact pad and the first carrier contact pad, wherein the first electrical connection comprises a first hollow space, and wherein the first hollow space comprises a first liquid; and a second electrical connection between the second component contact pad and the second carrier contact pad, wherein the second electrical connection comprises a second hollow space, and wherein the second hollow space comprises a second liquid. |
地址 |
Neubiberg DE |