Method for manufacturing a light-emitting element including a protective film for a charge injection layer

摘要

A method for manufacturing a light-emitting element. An anode is formed on a main surface of a substrate. A hole-injection layer is formed at least above the anode. At least the hole-injection layer is covered with a protective film. A bank which is provided with an aperture through which a portion of the protective film is exposed, is formed on the protective film by a wet process. The portion of the protective film exposed through the aperture is removed so that a portion of the hole-injection layer is exposed, a light-emitting layer is formed on the hole-injection layer exposed through the aperture, and a cathode is formed above the light-emitting layer. The protective film is resistant to a fluid used during the wet process.

主权项

1. A method of manufacturing a light-emitting element, comprising:
forming a first electrode on a main surface of a substrate; forming a layer including a metal compound above at least the first electrode; covering at least the layer including the metal compound with a protective film; forming banks that define an aperture through which a portion of the protective film is exposed using a wet process on the protective film; removing the portion of the protective film exposed through the aperture so that a portion of the layer including the metal compound is exposed, and forming a light-emitting layer on the layer including the metal compound exposed through the aperture; and forming a second electrode of a polarity different from a polarity of the first electrode above the light-emitting layer, wherein the protective film is resistant to corrosion by a fluid employed in the wet process, wherein the wet process comprises developing to form the banks and cleaning the banks after the developing, wherein the removing of the portion of the protective film exposed through the aperture comprises removal of the portion of the protective film exposed through the aperture by etching and cleaning after the etching, wherein the protective film is not corroded by the fluid used during the wet process and liquids used during the developing and the cleaning after the developing, and is corroded by a first liquid used during the etching of the protective film in the removing of the portion of the protective film exposed through the aperture, wherein the layer including the metal compound is not corroded by the first liquid used during the etching of the protective film in the removing of the portion of the protective film exposed through the aperture, and is corroded by a second liquid used in the cleaning after the etching thus exposing an inner surface thereof, and the light-emitting layer is formed on the exposed inner surface of the layer including the metal compound.