发明名称 |
Method of fabricating a GaN P-i-N diode using implantation |
摘要 |
A III-nitride semiconductor device includes an active region for supporting current flow during forward-biased operation of the III-nitride semiconductor device. The active region includes a first III-nitride epitaxial material having a first conductivity type, and a second III-nitride epitaxial material having a second conductivity type. The III-nitride semiconductor device further includes an edge-termination region physically adjacent to the active region and including an implanted region comprising a portion of the first III-nitride epitaxial material. The implanted region of the first III-nitride epitaxial material has a reduced electrical conductivity in relation to portions of the first III-nitride epitaxial material adjacent to the implanted region. |
申请公布号 |
US8822311(B2) |
申请公布日期 |
2014.09.02 |
申请号 |
US201113335329 |
申请日期 |
2011.12.22 |
申请人 |
Avogy, Inc. |
发明人 |
Kizilyalli Isik C.;Nie Hui;Edwards Andrew P.;Brown Richard J.;Disney Donald R. |
分类号 |
H01L29/20;H01L29/24 |
主分类号 |
H01L29/20 |
代理机构 |
Kilpatrick Townsend & Stockton LLP |
代理人 |
Kilpatrick Townsend & Stockton LLP |
主权项 |
1. A method for fabricating a III-nitride semiconductor device, the method comprising:
providing a III-nitride substrate of a first conductivity type and characterized by a first dopant concentration; forming a first III-nitride epitaxial layer of the first conductivity type coupled to the III-nitride substrate, wherein the first III-nitride epitaxial layer is characterized by a second dopant concentration less than the first dopant concentration; forming a second III-nitride epitaxial layer of a second conductivity type coupled to the first III-nitride epitaxial layer; removing a portion of the second III-nitride epitaxial layer to expose a portion of the first III-nitride epitaxial layer; implanting ions into an implanted region of the exposed portion of the first III-nitride epitaxial layer, the exposed portion of the first III-nitride epitaxial layer adjacent to a remaining portion of the second III-nitride epitaxial layer; forming a first metal structure coupled to the remaining portion of the second III-nitride epitaxial layer; and forming a second metal structure coupled to the III-nitride substrate; wherein a charge density in the implanted region is substantially lower than a charge density in the first III-nitride epitaxial layer. |
地址 |
San Jose CA US |