Methods, wires, and apparatus for slicing hard materials

摘要

Methods, wires, and apparatus for use in cutting (e.g., slicing) hard, brittle materials is provided. The wire can be a super-abrasive wire that includes a wire core and super-abrasive particles bonded to the wire core via a metal bonding layer. This wire, or another type of wire, can be used to slice workpieces useful for producing wafers. The workpieces can be aligned within a holder to produce wafers using the device and methods presently provided. The holder rotates about its central axis, which translates to workpieces moving in orbit around this axis. A single abrasive wire, or multiple turns of wire stretched tightly between wire guides, is then contacted with the rotating holder to slice the workpieces.

主权项

1. A composite super-abrasive wire for cutting hard materials, the composite super-abrasive wire comprising:
a wire core; super-abrasive particles disposed around the wire core; disposed on substantially an entire outer surface of each super-abrasive particle, a metal plating comprising at least two of tin, copper, lead, indium, silver, or bismuth; and a metal bonding layer bonding the metal platings of the super-abrasive particles around the wire core, wherein the metal bonding layer comprises (i) a soldering alloy, the soldering alloy comprising a plurality of metals, and (ii) a flux material.