发明名称 Sensor head for an X-ray detector, X-ray detector with sensor head and sensor arrangement
摘要 A sensor head for an X-ray detector is specified. The sensor head includes a first conductor carrier having a frontal face, and a sensor element sensitive to X-ray radiation. The sensor element is arranged on the frontal face of the first conductor carrier, is electrically conductively connected to conductors of the first conductor carrier and has a detection area. Furthermore, the sensor head includes contact elements electrically conductively connected to the sensor element via the first conductor carrier and bonding wires that electrically conductively connect the first conductor carrier to the contact elements. The sensor element is electrically conductively connected to the contact elements. In a plan view of the detection area, the detection area at least partly covers the bonding wires.
申请公布号 US8822923(B2) 申请公布日期 2014.09.02
申请号 US201213407533 申请日期 2012.02.28
申请人 Ketek GmbH 发明人 Scheid Oliver;Pahlke Andreas
分类号 G01T1/00;H01L25/00 主分类号 G01T1/00
代理机构 Slater & Matsil, L.L.P. 代理人 Slater & Matsil, L.L.P.
主权项 1. A sensor head for an X-ray detector, the sensor head comprising: a first conductor carrier having a frontal face; a sensor element that is sensitive to X-ray radiation arranged on the frontal face of the first conductor carrier, the sensor element being electrically conductively connected to conductors of the first conductor carrier and having a detection area; contact elements electrically conductively connected to the sensor element via the conductors of the first conductor carrier, wherein the contact elements comprise contact pins, wherein the contact pins, in plan view of the detection area, span an area whose content is less than the area content of the detection area; and bonding wires that electrically conductively connect the first conductor carrier to the contact elements such that the sensor element is electrically conductively connected to the contact elements, wherein, in a plan view of the detection area, the detection area at least partly covers the bonding wires, wherein the bonding wires are directly connected to the contact pins.
地址 Munich DE