| 摘要 |
The present invention relates to a system and a method for inspecting a circuit element using X-rays. The inspecting method is performed by the inspecting system using X-rays, by comprising: a step of radiating X-rays to an object to be inspected, and detecting X-rays penetrating the object in order to obtain a two dimensional (2D) penetration image; a step of deciphering the 2D penetration image in order to firstly decipher a defect of the object; a step of obtaining a 3D penetration image of the object, when a defect suspicious spot is determined to be included in the object in the first deciphering step; a step of deciphering the 3D penetration image in order to secondly decipher a defect of the object; and a step of classifying the object as defective, when a defect suspicious spot is determined to be included in the object in the second deciphering step. Therefore, the system and the method for inspecting the circuit element using X-rays can increase inspection accuracy and efficiency at the same time. |
