Multi-layer printed circuit board and method of manufacturing multi-layer printed circuit board

摘要

A multi-layer printed circuit board including a core substrate, lower interlayer resin insulating layers formed on the surfaces of the core substrate, respectively, through-hole conductors formed in penetrating holes penetrating through the core substrate and the lower interlayer resin insulating layers, conductor circuits formed on the lower interlayer resin insulating layers, respectively, upper interlayer resin insulating layers formed on the conductor circuits and the lower interlayer resin insulating layers, respectively and via hole conductors formed in the upper interlayer resin insulating layers and positioned on the through-hole conductors, respectively.

主权项

1. A multi-layer printed circuit board, comprising:
a core substrate having a first surface and a second surface on an opposite side of the first surface; a plurality of interlayer resin insulating layers including a plurality of lower interlayer resin insulating layers formed on the first and second surfaces of the core substrate, respectively, and a plurality of upper interlayer resin insulating layers formed on the lower interlayer resin insulating layers, respectively; a plurality of through-hole conductors formed in a plurality of penetrating holes penetrating through the core substrate and the lower interlayer resin insulating layers and including a plurality of first through-hole conductors and a plurality of second through-hole conductors; a plurality of conductor circuits formed on the lower interlayer resin insulating layers, respectively, and interposed between the lower interlayer resin insulating layers and upper interlayer resin insulating layers, respectively; a plurality of via-hole conductors including a plurality of lower via-hole conductors formed in the lower interlayer resin insulating layers and a plurality of upper via-hole conductors formed in the upper interlayer resin insulating layers; and a conductor pattern formed on one of the first and second surfaces of the core substrate and connecting the first through-hole conductors and the lower via-hole conductors, respectively, wherein the lower via-hole conductors are connected to the conductor circuits formed on the lower interlayer resin insulating layers, respectively, and positioned such that the plurality of lower via-hole conductors corresponds with a plurality of first external connection terminals, respectively.