发明名称 Epoxy resin composition for encapsulating semiconductor
摘要 PURPOSE: An epoxy resin composition is provided to have excellent flame retardance without using a flame retardant, and to have excellent flexability, adhesion, and reliability. CONSTITUTION: An epoxy resin composition comprises 2-15 weight% of an epoxy resin, 0.5-12 weight% of curing agent, 0.01-2 weight% of a curing accelerator, and 70-95 weight% of inorganic filler. As the epoxy resin, aromatic hydrocarbon formaldehyde resin-modified novolak type epoxy resin in chemical formula 1. In chemical formula 1, R1 and R2 is respectively and independently a C1-4 linear or branched alkyl group, the average K value is 0-2, and the average l value is 1-9.
申请公布号 KR101437141(B1) 申请公布日期 2014.09.02
申请号 KR20110107723 申请日期 2011.10.20
申请人 发明人
分类号 C08G59/14;C08K3/00;C08L63/10;H01L23/29 主分类号 C08G59/14
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