发明名称 Particle capture unit, method for manufacturing the same, and substrate processing apparatus
摘要 A particle capture unit adopted to be exposed to a space in which particles fly includes at least a first layer formed of a plurality of first fiber-like materials and a second layer formed of a plurality of second fiber-like materials. The first fiber-like materials are thinner than the second fiber-like materials and arrangement density of the first fiber-like materials in the first layer is higher than that of the second fiber-like materials in the second layer, the second layer is interposed between the first layer and the space, and the first and second layers are hardened and bonded together by sintering.
申请公布号 US8821607(B2) 申请公布日期 2014.09.02
申请号 US201213428614 申请日期 2012.03.23
申请人 Tokyo Electron Limited 发明人 Moriya Tsuyoshi;Toyoizumi Syunsuke;Takahiro Katsuyuki
分类号 B01D46/00;F04B37/08 主分类号 B01D46/00
代理机构 Rothwell, Figg, Ernst & Manbeck, P.C. 代理人 Rothwell, Figg, Ernst & Manbeck, P.C.
主权项 1. A particle capture unit in a substrate processing apparatus, the particle capture unit comprising: a sheet-shaped particle capturing multilayer structure including a first layer formed of a plurality of first fibers and a second layer formed of a multiplicity of second fibers, wherein the first fibers are thinner than the second fibers and an arrangement density of the first fibers in the first layer is higher than that of the second fibers in the second layer, wherein the substrate processing apparatus includes an exhaust system communicating with a pump having rotational blades, and wherein the exhaust system includes a gas-impermeable member having an inner peripheral surface, and further wherein a space is defined within the inner peripheral surface through which a particle-containing exhaust gas flows; wherein the multilayer structure is configured to be disposed along the inner peripheral surface of the gas-impermeable member such that the second layer is interposed between the first layer and the space, and wherein the first layer and the second layer are hardened and bonded together by sintering.
地址 Tokyo JP