发明名称 TREATMENT METHOD AND TEMPLATE FOR SUBSTRATE
摘要 <p>A substrate processing method of performing a predetermined processing by supplying a processing liquid to a processing region on a surface of a substrate, includes: supplying an alignment liquid to an alignment region on the surface of the substrate formed at a position different from that of the processing region; aligning a template disposed facing the substrate and including a processing liquid passage configured to pass the processing liquid and an alignment liquid passage configured to pass the alignment liquid, with respect to the substrate with the alignment liquid supplied to the alignment region such that the processing liquid passage is positioned above the processing region; and performing the predetermined processing on the substrate by supplying the processing liquid to the processing region through the processing liquid passage.</p>
申请公布号 KR20140105716(A) 申请公布日期 2014.09.02
申请号 KR20147013246 申请日期 2012.10.22
申请人 TOKYO ELECTRON LIMITED 发明人 IWATSU HARUO;TOSHIMA TAKAYUKI;SAKAMOTO KAZUO
分类号 H01L21/288;C23F1/02;C25D5/02;C25D7/12;H01L21/3205;H01L21/60;H01L21/768;H01L23/522 主分类号 H01L21/288
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