| 摘要 |
<p>The present invention is to improve a wiring property in a substrate where a semiconductor chip is mounted by a flip chip method. In a flip-chip-mounted semiconductor chip, an inside chip pad column and an outside chip pad column, which are arranged with zigzag shape in the inside and the outside of an IO cell, are separately arranged with a preset distance or more. The preset distance is a distance of arranging a via between the inside and the outside pad columns on the substrate, connected to face the inside and the outside chip pad columns. Or, the preset distance is a distance of forming the opening of a resist for etching back right after a plating line is arranged with the distance. Even if there is no spacer of forming a line between the outside substrate pad columns, the wiring property of the substrate is improved.</p> |
