LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING THE SAME

摘要

The present invention provides a light emitting device package including groups of light emitting device chips that independently operate in one package. According to an embodiment of the present invention, the light emitting device package includes a metal substrate; a first and second positive electrode pads which are insulated from the metal substrate and are located on the metal substrate; a first and a second negative electrode pads which are insulated from the metal substrate and are located on the metal substrate; a first light emitting device chip group which is located on the metal substrate, includes a plurality of the light emitting device chips, and is electrically connected to the first positive electrode pad and the first negative electrode pad; a second light emitting device chip group which is located on the metal substrate, includes a plurality of the light emitting device chips, and is electrically connected to the second positive electrode pad and the second negative electrode pad; and a fluorescent body member which is located on the metal substrate and covers the first light emitting device chip group and the second light emitting device chip group.