| 摘要 |
An electronic component unit includes a substrate, a semiconductor package mounted on the surface of the substrate, a heat sink including a pressing plate installed on the semiconductor package, a reinforcement plate arranged in the back surface of the substrate, and multiple combination holes which connect the pressing plat and the corner part of the reinforcement plate. The combination of the combination holes allows the substrate to pressurize the semiconductor package to be fixed. The reinforcement plate includes a base plate part which includes a connection part connected to the combination holes, respectively, and a pressing part which is arranged in the flat center side of the base plate part, is separately stacked on the base plate part, and pressurizes the back surface of the substrate. |
