| 摘要 |
<p>An objective of the present invention is provide to a method for forming a sintered silver coating film as a hear spreader which has excellent adhesiveness and thermal conductivity on a semiconductor substrate and a semiconductor package. A baking apparatus (30) includes: a chamber (32) for accommodating a plurality of workpieces W simultaneously in a baking room provided with, for example, a partition wall or a rectifying plate (31) and a stage (33), and the semiconductor substrate (12) having, on one surface thereof, an ink coating film KM containing silver nanoparticles; a ventilation unit (34) for discharging gas from the chamber while introducing air into the chamber (32); a temperature control mechanism (36) for controlling an atmosphere in the chamber (32); and a humidity control mechanism (38) for controlling a humidity in the chamber to a set value within a range of 30 to 50% RH (30°C).</p> |
