发明名称 THERMOPLASTIC, SEMICONDUCTIVE COMPOSITIONS.
摘要 Crosslinkable, semiconductive, peroxide-free thermoplastic compositions having a stable volume resistivity of less than 1000 ohm-cm comprise, based on the weight of the composition: A. 60-90 wt% silane-functionalized polyethylene; B. 0.5-20 wt% organopolysiloxane containing two or more functional end groups; C. 10-20 wt% high conductivity carbon black, e.g., a carbon black having an average particle size of 50 nm or less, a surface area (BET) of 700-1250 m2/g, and an oil absorption (DBP) of 300-500 ml/100 g; and D. 0.05 - 0.2 wt% crosslinking catalyst.
申请公布号 MX2014009222(A) 申请公布日期 2014.09.01
申请号 MX20140009222 申请日期 2013.01.29
申请人 DOW GLOBAL TECHNOLOGIES LLC. 发明人 NEIL W. DUNCHUS;JEFFREY M. COGEN;MOHAMED ESSEGHIR;SAURAV S. SENGUPTA
分类号 C08L101/10;C09D201/10 主分类号 C08L101/10
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